Trizeps VII

High-performance i.MX6 CPU module with compact dimensions

The Trizeps VII is one of the world‘s most powerful NXP i.MX6 CPU modules and is suitable for multimedia, multitouch and multidisplay applications as well as for demanding control tasks. It uses the full performance potential of the NXP i.MX6 processor with the compact form factor of the SODIMM 200 standard.

Features Freescale i.MX6 CPU module
Features Freescale i.MX6 CPU module

Available with Microsoft Windows 10 IoT Core, Windows Embedded Compact 7, 2013, Linux and Android operating systems

  • Trizeps SODIMM-200 compatible
  • Same form factor for Solo-, DualLite-, Dual- and Quad-Core versions
  • Additional highspeed-functions with the new board-to-board connector
  • Dual antenna +18dBm WiFi / BT
  • Audio codec and ethernet transceiver
  • 64 Bit RAM


1 NXP i.MX6 ARM Cortex A9 processor (i.MX 6Quad, i.MX 6Dual, i.MX 6DualLite, i.MX 6Solo)  –  2 DDR3 RAM  –  3 SODIMM 200 connector, interfaces: 24 Bit RGB LCD, 8 Bit Camera, Address Data Bus, USB 2.0 Host, USB 2.0 OTG, 2x FlexCAN, PCI-Express, 3x UARTs, I2C, SPI, GPIOs, PWM, RTC, AC97, headphone out, speaker out, microphone, LineIn, resistive touch, ACDs, 10/100 Mbit Ethernet, 4 Bit SD1 port, PCM, 3V3 power supply  –  4 Socket for μSD cards (eMMC optional)  –  5 Bluetooth UFL coax connector  –  6 WiFi UFL coax connector  –  7 WiFi-Bluetooth module (optional)  –  8 Power Management IC (PMIC)  –  9 SPI NOR Flash up to 512 Mbit (on request)  –  10 High-Speed board-to-board connector, 60 pole, interfaces: MIPI camera, MIPI display, SATA-II, Dual-LVDS (WUXGA), HDMI v1.4 (3D, 4k x 2k, 1080p), RGMII 10/100/1000 Mbit  –  11 Ethernet Transceiver  –  12 Audio Codec / resistive Touch  –  13 Ground potential for EMC heat sink connection


Constantly high quality through multi-stage test of each individual CPU module
To ensure a constantly high quality, each individual CPU module is passed through a multi-stage test. The test result covers 100% of all interfaces.
• AOI/MOI: Multiple automatic and manual optical control of each CPU module during the production.
• JTAG/Boundary Scan Test: JTAG/Boundary Scan Test: The signal of each pin which is accessible via the JTAG chain is checked for connection, shorts, missing pull-up/down resistors. The DDR Ram is tested for row/column pin assignment.
• Functional tests of high-speed and analog interfaces (Ethernet, display, USB, audio, etc.) which are not testable via JTAG

SODIMM Standard
The Trizeps VII includes the Keith & Koep SODIMM 200 Standard, the world‘s longest existing SODIMM standard. Like no other module standard, the SODIMM 200 ensures the pin compatibility of the Trizeps modules.


Technology Partner
ARM Logo       Windows Gold Partner Logo       Adroid Linux Logo       NXP Proven Partner Logo

Compatible with

i-PAN T7

Compact 7.0" Touch Panel Computer with metal assembly frame
i-PAN T7 CoverLens

Modular 7.0" Touch Panel Computer
i-PAN T10 CoverLens

Modular 10.1" Touch Panel Computer

Compact and flat 7.0" Touch Panel Computer with metal assembly frame

7.0" Build-in Touch Panel Computer
i-PAN XT-Pro 10

10.1" Build-in Touch Panel Computer

Compact Trizeps SODIMM 200 Baseboard

Very multifunctional Trizeps VII SODIMM 200 Baseboard

Compact and scalable Trizeps VII SODIMM 200 Baseboard
Trizeps VII SX

NXP i.MX 6SoloX SODIMM 200 CPU module
Trizeps VIII Mini

NXP i.MX 8M Mini SODIMM 200 CPU module
Trizeps VIII Plus

NXP i.MX 8M Plus SODIMM 200 CPU module (soon available)
Trizeps VIII Nano

NXP i.MX 8M Nano SODIMM 200 CPU module
Trizeps VIII

NXP i.MX 8M SODIMM 200 CPU module
Overview CPU modules